POSITION DESCRIPTION
Position Title: Auto Pick Operator – All Levels
Reports To: Production Manager
Department Name: 150 Mfg-Pick and Place/Plate
Location: Silicon Valley
FLSA Status: Non-Exempt
Swing shift: Monday-Friday 2:30PM-11:00PM
POSITION SUMMARY
Perform auto and manual Pick and Plate die from wafers to waffle pack or gel pack per customer’s requests by emaps or inked dots.
KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE
Level 1:
- Read work traveler to determine if wafers require UV exposure.
- Operate machine for wafer stretching 6-, 8- or 12-inches wafers.
- Prepare for remnant packaging that uses label identification, packing and vacuum sealing of wafer remnants.
- Perform die plating monitor and inspect product by using CTC-255.
- Identify defects detected; punch holes, scratches, edge chipping, edge scalloping, debris, or any other issue related to plating.
- Responsible for top side and back side inspection.
- Inspect wafer to identify defects prior to plating.
- Permanent mark the number on the cover and bottom of waffle pack or gel pack in order prior to plating.
- Monitor and track waffle pack or gel pack with bin number or die ID.
- Ensure all the die on waffle pack are same orientation during back fill.
- Recognize mis-picks, mis-alignments, broken parts, monitor machine for any failures.
- Use the right tool to pick to prevent damage the die based on the special.
- Learn the process for laminated material that requires UV cure.
- Meet quality goals, safety requirements, and follow company policies.
- Flexibility to perform other duties as assigned.
Level 2:
- Perform full process of remnant packaging, die plating monitoring procedure.
- Monitor pick and plate machine and pick tool cleaning and backfill procedure.
- Set up machine for wafer testing including inked wafer and wafer map.
- Wafer remnant verification and wafer matching with actual wafer map.
- Check the die counts and verify quantities on the map match with total die counts on the traveler, multiple bin picking and parameter adjustment.
- Set up machine from start to finish including setup machine for inked wafer, wafer map, train and align the input and output. Reboot machine if needed.
- Load actual wafer to match the wafer map.
- Set up camera vision to focus on input and output point.
- Match wafer remnant map with actual remnant and check for missing bad die, ability to resize maps to match actual remnant and track for misalignment.
- Meet quality goals, safety requirements, and follow company policies.
- Flexibility to perform other duties as assigned.
Level 3:
- Troubleshoot machine: know the root cause and be able to solve machine problems to eliminate chip/crack or repetitive defects.
- Emap preparation: understanding of emaps formats for each machine and process. Be able to edit, load into machine and verify for correct wafer, bin quantity and alignment.
- Creating new recipes: be able to gather information of new customer, pick the best tools & machine in order to create new recipes.
- Able to planning and expediting jobs base on knowledge of machine capabilities, operator capabilities, and job difficulty.
- Reworking Jobs: able to perform root cause analysis, and then determine best procedure and machine for reworking jobs.
- Able to support engineering jobs with special instructions for machine setup.
- Flexibility to perform other duties as assigned.
Lead:
- Serve as back-up team leader and perform operator pass down at shift change.
- Responsible for inventory, material requests and hands-on job execution to ensure on time delivery.
- Verify machine setup and update department schedules.
- Provide on-the-job training for new operators.
- Flexibility to perform other duties as assigned.
JOB REQUIREMENTS INCLUDE
Education: High school diploma or equivalent required.
Level 1:
Experience:
- 6 months in wafer die prep environment preferred.
- Experience in wafer inspections.
Level 2:
Experience:
- At least 2 years in wafer die prep environment preferred.
- Experience in wafer inspections.
Level 3:
Experience:
- One-year related experience required; three-year experience preferred.
- Experience in wafer thinning, dicing, pick and place and/or inspection.
Knowledge/Skills:
- Good documentation skills and good multi-tasking skills.
- Proficient understanding of semiconductor Die Prep processes.
- Ability to be self-motivated and independent.
- Exceptional communication skills.
- Good mechanical aptitude.
- Ability to learn, program, and operate various types of equipment.
- Proficiency with Microsoft Office.
SUPERVISORY RESPONSIBILITIES
Total Number of Employees Directly Supervising: _0_
Number of Subordinate Supervisors Reporting to Position: _0_
This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.
In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
Graveyard Shift: 10:00 PM – 6:30 AM Monday-Friday