Description
In response to the COVID-19 pandemic, Hitachi High-Tech America, Inc. adopts, implements, and updates certain safety protocols in its efforts to promote a healthy and safe workplace for the well-being of our employees, their families, and visitors to our facilities, and to pursue continuity of the Company’s business operations. Where permitted by law, new hires will be required to disclose and certify COVID-19 vaccination status shortly after hire.
WORK LOCATION: Hillsboro, OR (PEC, NCP)
WORK STYLE DESIGNATION: Hybrid (+50% Onsite)
WORK STYLE REQUIREMENT: Onsite – 80%/Remote – 20%
EXPECTED PAY RANGE (Level 1-3): $59,312.00 – $121,688.00
This pay range is for the position’s base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process.
POSITION SUMMARY
The Process Engineer I position is located in Portland, Oregon and supports the business objectives of HTA’s Semiconductor Equipment Division (SED). The main objective of this position is to provide process engineering support to the Portland Research and Development (PRD) group, and related programs associated with plasma etchers and Reactive Ion Etch (RIE) processes. This is a developmental position where the engineer is expected to acquire job skills, learn company policies and procedures, perform routine tasks, enhance process development skills and acquire hardware proficiency. Continued training will be given to develop specific skills and knowledge. The employee must be willing to travel to Japan for a 1-3 month training assignment if necessary. The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level within 3 years. The engineer is also interfacing with engineers globally so strong interpersonal skills are required.
PRIMARY RESPONSIBILITIES
- Day-to-Day responsibilities include: completing assigned tasks in a timely fashion, learning routine development tasks and tool operation, and acquiring specific process development knowledge and skills.
- Perform hands-on RIE/dry etch process development. This includes performing customer demonstrations, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes.
- Perform etch process development to support productivity programs related to meeting the targeted customer specifications. This includes interacting with the customer to understand needs, making process and dry clean adjustments, and achieving defectivity and process stability specs.
- Utilize analytical tools & techniques to solve process development issues.
- Analysis of data, design and execution of experiments including DOE.
- After training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment including scanning electron microscopy, focused ion beam milling, and thin film metrology techniques.
- Working under supervision, must be able to complete process development tasks after receiving instructions.
- Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications.
- Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues.
EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS
- BS Degree in Chemical Engineering, Materials Science, Electrical Engineering, related field, or equivalent experience.
EXPERIENCE AND TRAVEL REQUIREMENTS
- 0-5 years Plasma Etch Process Experience or semiconductor processing preferred.
- Possible travel to Japan for training or customer sites worldwide as needed
SKILLS AND ABILITIES REQUIREMENTS
- Must be willing to travel to Japan for 1-3 month training assignment.
- Periodic oversees business trips may be required throughout the year.
- Strong general technical knowledge of semiconductor wafer processing.
- Fundamental understanding of and experience with Dry Etch / RIE.
- Self-motivated and show ability to adapt to changes in a fast moving environment.
- Strong knowledge of chemistry, the ability to analyze OES data, and utilize other predictive software is required.
- Strong engineering analytical/problem solving skills. Understanding of scientific method and experience using it.
- In depth knowledge of Design of Experiments (DOE).
- Candidate must have good verbal and written communication, strong analytical capabilities and trouble shooting skills, and must work well in a team environment.
- Demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
- Ability to work in teams in leadership and subordinate roles.
- Must be able to work in a clean room environment for extended hours.
- Oversee some of the logistics of the demo lab like: tacky mats, LN2 fill, clean room garments pick up and drop off, miscellaneous supply needs, and occasional delivery or pickup of demo lab parts or wafers.
- Research, create and submit purchase orders for materials and services
- Strong computer skills including Microsoft Office software competency.
Equal Opportunity Employer (EOE)-Females/Minorities/Protected Veterans/Individuals with Disabilities
If you require reasonable accommodation in completing this application, interviewing, completing any pre-employment testing, or otherwise participating in the employee selection process, please direct your inquiries to [email protected]