Staff Package Design Engineer – SIPI, Routing and Layout

The Tenstorrent team combines technologists from different disciplines who come together with a shared passion for AI and a deep desire to build great products. We value collaboration, curiosity, and a commitment to solving hard problems. Find out more about our culture.

Tenstorrent is seeking motivated individuals to join its newly formed packaging team. We have multiple positions available for mid- to senior levels of experience. The focus area for hiring is Signal/Power integrity, routing and layout, and process technology. We’re growing!

General Requirements

    • Design and develop package solutions for IC products, considering electrical, thermal, and mechanical requirements.
    • Work closely with chip design engineers to optimize package design for the specific IC product.
    • Conduct simulations and analyses to ensure package performance meets requirements.
    • Develop and implement package manufacturing processes and procedures.
    • Collaborate with external vendors and partners to ensure timely delivery of package components (external design, manufacturing, and assembly)
    • Perform package testing and validation to ensure product quality and reliability.
    • Work with cross-functional teams to ensure that packaging solutions meet product specifications and customer requirements.
    • Prior experience in developing packages based on chiplets and optical modules is an asset.

Specific Requirements

    • Minimum 5 years of experience in IC package design, development, and testing.
    • Signal Integrity analysis of high-speed signals and interfaces
    • Power/Signal integrity from silicon to package to PCB
    • HS/LS signal routing, bump and BGA mapping, and layout design
    • Package technology, manufacturing, and process development
    • Strong knowledge of package design tools, simulation software, and analysis techniques.
    • Proficient in packaging materials, thermal management, and electrical interconnects.
    • Experience with package manufacturing processes and procedures.

Non-technical requirements• Strong communication and collaboration skills. • Ability to work independently and as part of a team. • Take the initiative, and make cross-functional team alignment.

    • Strong communication and collaboration skills.
    • Ability to work independently and as part of a team.
    • Take the initiative, and make cross-functional team alignment.

Compensation for all engineers at Tenstorrent ranges from $100k – $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

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